Adjusting Wetting and Adhesion Characteristics with ALD and MLD, 2014 PLACE Conference

Please Note: This document will be available in PDF format in the "My Electronic Documents" link on the home page once your order has been completed. Please make sure you have the latest version of Acrobat Reader. Click on the Acrobat Reader icon to check for the latest version, it’s FREE. To print a hardcopy of a PDF file correctly you must have a postscript printer. If you are not sure if your printer is a postscript printer please refer to your owner’s manual.

Purchase of electronic (downloadable) documents made at www.tappi.org by credit cards, followed by instant download CANNOT be cancelled. We do not offer refunds on electronic download documents.

Atomic and molecular layer deposition (ALD and MLD, respectively) are based on repeated cycles of gas-solid surface reactions. A monolayer of precursor molecules is chemisorbed onto the surface during a single deposition cycle, enabling control of thin film growth in principle down to sub-monolayer resolution. This level of control has made ALD and MLD interesting for various applications.