Formulating Hot Melt Adhesives with CHDM Dibenzoate, 1991 Hot Melt Symposium Proceedings

Benzoflex 352 (chdm dibenzoate)* from Velsicol has excellent compatibility with most hot melt raw materials, a very high melting point(l18 deg. C), and a high flash point, so it was decided to determine if these unusual properties result in benefits in hot melt adhesives and other adhesives.

Three studies were undertaken to determine what benefits occurred, what levels of use should be evaluated, to determine efficacy in various types of adhesives, and to speculate on possible end uses where these properties may be of use.

The results show that incorporation of chdm dibenzoate shows potential advantages in all types of hot melts studied, and the advantages range from increased heat resistance, viscosity, improved adhesion, reduced improved open time with apparently no reduction in setting speed, to improving compatibility.

*This paper is a modification and update of a paper originally presented at the Adhesive and Sealants Council’s April 15, 1991 Meeting (St. Louis, MO.)

*Note Benzoflex is the trademark of Velsicol Chemical Corp.