Moisture Curing Hot Melt Adhesives, 1994 Hot Melt Symposium Proceedings

Thermoplastic hot melt adhesives provide the advantage of a non-polluting application process and the benefit of rapidly increasing green strength shortly after application.

Therefore, the failure temperature of a bond is very limited because the application temperature for many substrates cannot be increased above a certain level. Further, exposure of most hot melt adhesives to higher application temperature than 200 degrees Celcius frequently results in decomposition and loss of desired properties.

Moisture Curing Hot Melt Adhesives, 1994 Hot Melt Symposium
Moisture Curing Hot Melt Adhesives, 1994 Hot Melt Symposium Proceedings
35.00

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