New Generation of Low Density Hot Melt Packaging Adhesives, 1994 Hot Melt Symposium Proceedings

D. A. Godfrey, L. A. Ardemagni

Hot melt adhesives for packaging applications have undergone significant improvements as faster set times, wider ranges of end use temperature, and adhesion to more difficult to bond substrates have been required by customers. Recent adhesive developments have allowed for the formulations of a new generation of packaging adhesives that has expanded the temperature use range (both low and elevated temperatures) of hot melt adhesive. These new adhesives also exhibit very fast set speeds, excellent adhesion to a wide variety of substrates including recycled boardstock, and a low density (below 0.95 g/cc) for greater adhesive mileage and ease of removeability in the recycling process.

Author: Godfrey, D.A., Ardemagni, L.A.
New Generation of Low Density Hot Melt Packaging Adhesives,
New Generation of Low Density Hot Melt Packaging Adhesives, 1994 Hot Melt Symposium Proceedings
35.00

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