New Developments in Case and Carton Sealing Hot Melt Adhesive Technology, 1995 Hot Melt Symposium Proceedings

D. C. Stauffer

I. Liedermooy

National Starch and Chemical Co.

Packaging applications represent a large potential market for hot melt adhesives. Two new exciting technologies are finding utility for value added installations.

Unique hot melt adhesives have been formulated for superior adhesion to dense and recycled corrugated. The adhesive offers improved elevated temperature performance, improved sub-ambient adhesion, excellent thermal stability, and low density. This unique combination of properties renders conventional packaging hot melt adhesives obsolete.

Current typical hot melt adhesives for packaging are designed for use at temperatures around 177°C. A new generation of hot melt adhesives is upon us which can be applied at 111°C. The advantages of this include reduced risk of thermal bums, lower energy costs for the adhesive user, less odor, improved thermal stability, and longer equipment life.

Author: Stauffer, D.C., Liedermooy, I.
New Developments in Case and Carton Sealing Hot Melt Adhesiv
New Developments in Case and Carton Sealing Hot Melt Adhesive Technology, 1995 Hot Melt Symposium Proceedings
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