Conversion from Solvent Based PSA Technology to Low VOC Hot Melt or UV/EB Curbale PSAs: An Economic and Technical Justification, 1999 Hot Melt Symposium Proceedings
Tom Kauffman
Hot Melt Technology
H.B. Fuller
There is currently a pronounced movement in Europe out of solvent based pressure sensitive adhesive (PSA) technology for the production of tapes and label stock into low volatile organic compound (VOC) alternatives such as hot melts and UV/EB PSAs. In the U.S. the movement away from solvent technology for tape production has been less dramatic due to both technical and economic concerns. Recent advances in both hot melt and UV/EB curable adhesive technology, however, are offering a wide variety of performance options and are eliminating concerns about technical viability. Considering the higher capital and operational costs of solvent based PSA technology, a strong argument can be made for selective conversion to the low VOC technologies by U.S. tape manufacturers.