Measuring the Stress-Strain Properties of Paperboard in the Thickness Direction, 1999 International Paper Physics Conference Proceedings

Niclas Stenberg, Sören Östlund

In this paper, a device for measuring stress-strain properties in the thickness direction of paperboard was presented. The principle was the same as the Arcan device but modified with an attached fixture that restricted the movement to the desired plane of deformation. The modified Arcan device was used for tensile, compression and shear loading. In this method, the paperboard was first glued to metal blocks with a of high-viscosity adhesive. The blocks were then attached to the Arcan device. To find the true strain in the material, knowledge of the penetration of the glue into the surface of the paper structure was important. A method for determining the penetration of the glue, based on comparison of stress-deformation curves with glued and non-glued test pieces was presented. Finally, true stress-strain curves in tension, compression, and shear were presented together with an analysis of the accuracy of the method.