Effect of Bond Point Design and Bond Strength on the Load-Deformation of Point Bonded Nonwovens: A Computer-Based Study, 1993 Nonwovens Conference Proceedings
Thomas F. Gilmore, X. Mi Zhong, Subhash K. Batra
Thermal point bonding via embossing calenders is the most-utilized bonding technology for nonwovens, being used for carded, spunbond, melt blown, and composites. Optimization of bond patterns for thermal point bonding is difficult experimentally due to the expense and lead time associated with engraved calender rolls, thus products are likely being commercialized with less than optimum designs. A previously-developed mechanical model to estimate tensile properties of point bonded fabrics was used to “experiment” with the effect of percent bond area, bond strength, and fiber elongation-to-break on tensile properties of a 60 g/m2 fabric. Tensile breaking strength and energy-to-break were generally found to increase with percent bond area and fiber elongation, except for the case of weakest bond points where fiber pullout dominates.
Effect of Bond Point Design and Bond Strength on the Load-Deformation of Point Bonded Nonwovens: A C