Development of a Model for Ultrasonic Bonding Processes of Nonwovens, 1997 Nonwovens Conference Proceedings

The development of a model to predict the bonding behavior of nonwovens during ultrasonic bonding processes is presented. The model includes several subprocesses and each process is modeled first and then an overall model is obtained. The Finite Element Method (FEM) is used to solve the above coupled model. Subsequently the temperature profile and the heating rate can be calculated.

Author: Mao, Z., Goswami, B. C.
Development of a Model for Ultrasonic Bonding Processes of N
Development of a Model for Ultrasonic Bonding Processes of Nonwovens, 1997 Nonwovens Conference Proceedings
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