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Hot melt dimer-based polyamides are widely used as adhesives for bonding dissimilar materials in durable goods. The changes in the physical and adhesive properties of these polyamides as they cool are important because these adhesives are often applied hot to an unheated substrate and then contacted with the other unheated substrate. We have looked at the open assembly time of films of some commercial hot melt polyamides. These times can be related to observed changes in the physical properties of the polyamides using the temperature of the adhesive. We have used dynamic mechanical and differential scanning calorimetric analysis to understand the physical changes in the adhesive as it is cooling.
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Relationship of Dynamic Mechanical and Thermal Properties to Tack for Hot Melt Polyamide Films, 1990