IR and DMA Analysis of a Two Component Adhesive System, 1990 Polymers, Laminations & Coatings Conference Proceedings

For those involved in the production of flexible packaging laminations, bond failure can be very costly. Failure of the bond can be the fault of the substrate, primer, adhesive, inks and colorants or mechanical production. It is prudent for the laminator to have ways to identify the source of the problem. Many laminating adhesives are tow part systems supplied to the customer with a recommended ratio. When a laminator is experiencing product failure, the laminating adhesive is often suspected as the problem. In order to determine if the adhesive in a lamination is the source of failure, instrumental analysis by Fourier Transform Infrared Spectroscopy (FT-IR) and Dynamic Mechanical Analysis (DMA) can provide valuable data as to the compositional and structural integrity of the adhesive.

Author: Jette, J.K., Gilmore, J.R., Kelsey, W.E.
IR and DMA Analysis of a Two Component Adhesive System, 1990
IR and DMA Analysis of a Two Component Adhesive System, 1990 Polymers, Laminations & Coatings Conference Proceedings
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