Title: The Facts Regarding Alternative Adhesive Technologies Used to Reduct Volatile Organic Compound Emissions, 1991 Polymers, Laminations & Coatings Conference Proceedings
The purpose of this paper will be to present available facts and discuss developing trends regarding the reduction or elimination of solvent emissions generated during the dry bond laminating process. This process, used to prepare flexible structures for food packaging and other end uses, has the potential to emit to the atmosphere organic solvents for which regulatory controls are in place to limit the kind and amount. Strategies will be discussed to comply with these regulations, such as engineering controls, high solids / 100% solids adhesives, water based adhesives and high energy cure systems. Each strategy has distinct performance limitations, long and short term objectives and cost effectiveness parameters.