Prediction of Temperature Profiles Across Coating and Substrate in the Nip, 1999 Polymers, Laminations & Coatings Conference Proceedings
Yves Trouilhet
DuPont de Nemours Int. SA,
Geneva, Switzerland
Barry A. Morris
E. I. DuPont de Nemours & Company
Wilmington, Delaware USA
An unsteady-state, one-dimensional heat conduction model is used to calculate the temperature profiles in
the melt and the substrate(s) when they come into contact in the nip of the extrusion coating or lamination
process.
The model helps answer such questions as:
-Is the melt totally quenched in the nip?
-Will the substrate(s) be exposed to temperatures above which shrinkage occurs?
-Will the temperatures promote post-crystallization?
The answers to these questions aid in the understanding of adhesion, curling and optical problems in extrusion coating.
Prediction of Temperature Profiles Across Coating and Substrate in the Nip, 1999 Polymers, Laminatio
